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Self Diagnostic Adhesive for Bonded Joints in Aircraft Structures

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Technical Report,15 Mar 2013,14 Mar 2016

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Leland Stanford Junior Univ CA Stanford United States

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Bondline integrity is one of the most critical concerns in the design and operation of aircraft and spacecraft structures up to date. Nevertheless, current state-of-the-art non-destructive evaluation NDE and structural health monitoring SHM techniques are incapable of offering mature solutions regarding bondline integrity monitoring. Therefore, the objective of the proposed research is the development of a complete approach for integrity monitoring and self-diagnosis of adhesively bonded structures. During the reporting period, three major accomplishments were achieved1 Screen-printed piezo-electric sensors of the new design were developed and fabricated. The new sensors had a smaller dimension compared to the previous design to minimize the parasitic effect when embedded into bondlines. 2 The developed impedance-based diagnostic algorithms were validated under the fatiguedynamic loading condition. 3 Both SEM Spectral Element Modeling and FEM Finite Element Modeling simulation of the impedance of the embedded piezo-electric sensor was conducted.

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