Accession Number:

AD1017374

Title:

Characterization of Magnetron Sputtered Copper-Nickel Thin Film and Alloys

Descriptive Note:

Technical Report,01 Oct 2015,01 Jul 2016

Corporate Author:

US Army Research Laboratory Adelphi United States

Personal Author(s):

• Zakar, Eugene
• Chen,Andrew
• Burke,Robert
• Hirsch,Samuel G
• Strnad,Nicholas
• Mulcahy,James

Report Date:

2016-09-01

Pagination or Media Count:

18.0

Abstract:

Copper Cu-nickel Ni thin films are prepared by magnetron sputtering using an AJA International model ATC-2200 system. The as-deposited films are in the amorphous state during room temperature deposition but transition to a crystalline state at an elevated substrate temperature beyond 250 deg C. The crystalline films have a mixed 111- and 200-oriented texture that becomes predominantly 111-orientated after an annealing treatment. Bilayer CuNi deposited films with ratio of 121, 61, 41, and 31 produced final alloy concentrations of 9010, 8317, 7624, and 7030 atomic , respectively, after annealing, and their average surface roughness increased with higher Cu concentration. These results show that the final thin film alloy composition can be effectively controlled by varying the ratio of the initial deposited Cu and Ni layers. The morphology of these films were studied by atomic force microscope AFM, X-ray Diffraction XRD, electrical 4-point probe, and energy-dispersive X-ray spectroscopy EDX.

Descriptors:

• thin films
• sputtering
• room temperature
• annealing
• surface roughness
• x ray diffraction
• chemical vapor deposition
• substrates
• copper nickel alloys
• magnetrons
• deposition
• x ray spectroscopy
• low pressure

Subject Categories:

Distribution Statement:

APPROVED FOR PUBLIC RELEASE