Advanced Research in Optical Refrigeration and Applications (ARORA)
Technical Report,01 Oct 2010,30 Sep 2013
University of New Mexico Albuquerque Albuquerque United States
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A significant improvement in thermal properties is measured for the sapphire thermal link, compared to the fused silica link. When measured quantitatively, it can be seen that no thermal barrier exists for the Van Der Waals bonded sapphire link, while adhesive imposes significant impedance. Additionally, no thermal gradient exists along the length of the sapphire link, thanks to the high thermal conductivity, whereas the fused silica link exhibits a significant gradient.