Accession Number:

AD0918501

Title:

Multilayer Interconnections for Hybrid Microcircuits.

Descriptive Note:

Final rept. Jul 70-Feb 72,

Corporate Author:

SYLVANIA ELECTRIC PRODUCTS INC WALTHAM MA MODULE OPERATIONS

Personal Author(s):

• Moore, John R.

Report Date:

1974-04-01

Pagination or Media Count:

146.0

Abstract:

This program covered an investigation of the failure modes and mechanisms for two types of ceramic multilayer substrates mounted within a hermetic package and the development of suitable tests which were modified and are submitted as recommendations for the evaluation andor qualification testing of high reliability substrates. The technical guidelines for the contract specify the two types of test substrates as follows 1 Thick Film Multilayer Conductor System composed of successive layers of screened conductors and dielectrics, and 2 Homogeneous Metal-Ceramic Multilayer System composed of individual layers of green ceramic, each layer having a conductor pattern. These layers are stacked and fired simultaneously to form a monolithic metal-ceramic multilayer structure.

Descriptors:

• *HYBRID CIRCUITS
• *PRINTED CIRCUITS
• *SUBSTRATES
• CIRCUIT INTERCONNECTIONS
• THICK FILMS
• CERAMIC MATERIALS
• INTEGRATED CIRCUITS
• HEAT TREATMENT
• RELIABILITY(ELECTRONICS)
• SINTERING FURNACES
• DEPOSITION
• MANUFACTURING
• DIELECTRIC FILMS
• THERMAL STABILITY
• SHOCK RESISTANCE
• ACCELERATION
• METAL FILMS
• BONDING
• MICROCIRCUITS

Subject Categories:

• Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE