Accession Number:

AD0917846

Title:

Some Applications of Hybrid Thick Film Technology.

Descriptive Note:

Final technical rept. 27 Jan 72-13 Sep 73,

Corporate Author:

ALEPH INC GARLAND TX

Personal Author(s):

• Alford, James L.
• Jackson, Donald G.

Report Date:

1973-09-12

Pagination or Media Count:

83.0

Abstract:

Hybrid thick film technology from its inception provided a capability that cannot currently be duplicated by any other solid-state active device process. This program explored the utilization of this technology by breadboarding various versions of low-power communications devices. It was established that the technology is capable of producing high yield, reasonable cost equipment of extremely miniature size, high efficiency and low power consumption. The potential applications explored were not all inclusive. The processes used can now be considered reliable, state-of-the-art fabrication techniques. Author

Descriptors:

• (*THICK FILMS
• HYBRID SYSTEMS)
• (*COMMUNICATION EQUIPMENT
• THICK FILMS)
• BREADBOARD MODELS
• MICROMINIATURIZATION
• MICROELECTRONICS
• MICROPOWER CIRCUITS
• RESCUE BEACONS
• TRANSMITTER RECEIVERS
• RADIOACTIVE ISOTOPES
• MODULATORS
• POWER AMPLIFIERS
• SPEECH
• DC TO DC CONVERTERS
• POWER SUPPLIES
• ELECTRIC GENERATORS
• LITHIUM
• ELECTRIC BATTERIES
• RADIO RECEIVERS

Subject Categories:

• Electrical and Electronic Equipment
• Non-Radio Communications

Distribution Statement:

APPROVED FOR PUBLIC RELEASE