Accession Number:

AD0911412

Title:

High-Speed Optical Data Link for Interconnection between LSI Modules

Descriptive Note:

Final rept. Mar 1972-Mar 1973

Corporate Author:

IBM FEDERAL SYSTEMS DIV OWEGO NY ELECTRONICS SYSTEMS CENTER

Report Date:

1973-04-01

Pagination or Media Count:

106.0

Abstract:

An investigation of the use of optical communications for interconnecting AADC modules is performed. Both system and optoelectronic device studies are performed. An investigation of various light sources primarily light emitting diodes LEDs and injection laser diodes and photodetectors silicon and germanium photodiodes PDs, phototransistors, etc. is performed, and the properties of these devices are analyzed. The most appropriate light emitters for near term applications are GaAsLEDs and heterostructure or Large Optical Cavity injection lasers for future applications. Silicon PIN photodiodes meet the present photodetectors requirements for the AADC, or avalanche photodiodes can be used where photocurrent gain andor larger bandwidths are required. A study of mounting techniques for the LEDs and PDs is performed with respect to the mechanical and optical properties of the devices. This investigation yielded two general configurations, on-wafer and off-wafer. Even though the on-wafer approach may result in somewhat higher speed capability, the mechanical and optical complexity involved indicates that the off-wafer mounting of the optoelectronic devices is presently a more feasible and economical approach. Various conceptual designs of optically interconnecting the AADC moudles are investigated. A candidate configuration is established where the optical path extends from the optoelectronic devices to the edge of the module via a light guide and is routed to another module via fiber optics which is located in the side panels. A theoretical analysis of the light coupling losses at the fiberfiber interface is performed and experimental data taken.

Subject Categories:

  • Electrooptical and Optoelectronic Devices
  • Non-Radio Communications

Distribution Statement:

APPROVED FOR PUBLIC RELEASE