Production Engineering Measure, Solid Encapsulated Semiconductor Devices.
Quarterly progress rept. nos. 9 and 10, 1 Jan-1 Sep 72,
MOTOROLA INC PHOENIX AZ SEMICONDUCTOR GROUP
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The purpose of this PEM is to develop the production capacity and processing methods necessary to produce a plastic encapsulated small signal transistor capable of qualifying for military applications. The program planned for this PEM will concentrate on three aspects of transistor manufacture i.e., passivation techniques with standard aluminum front metal used during chip fabrication, a new titanium platinum gold front metal system, and various assembly schemes to optimize encapsulation of the chips. To illustrate the proposed development scheme, Block Diagram of PEM Manufacturing Techniques, has been included.
- Electrical and Electronic Equipment