Accession Number:

AD0903797

Title:

Exploratory Development of High Temperature Resins for Structural Laminates and Adhesives.

Descriptive Note:

Technical rept. 1 May 71-1 May 72,

Corporate Author:

WHITTAKER CORP SAN DIEGO CA RESEARCH AND DEVELOPMENT DIV

Report Date:

1972-08-01

Pagination or Media Count:

55.0

Abstract:

The polyimidazoquinazoline, PIQ, heterocyclic resin system has been investigated as a high-temperature support resin, and to a limited extent, as a structural adhesive, in several trifunctional and difunctional modifications. Marked improvements in ring-closure efficiency, providing an integral cyclized structure, have been realized through the use of a streamlined cure-postcure schedule which has included a short-term final exposure to temperatures exceeding 90 F the approximately glass-transition temperature of the system preferably at 975 F. Low-void, high-perfection laminates have been fabricated with Modmor-II unidirectional reinforcement whose flexural properties equal or exceed the levels of capability of conventional high-performance support resin systems. Further, when a 100 trifunctionally-curing system was used AF-R-530 triazine centered crosslink, in conjunction with the streamline cure-postcure, a singular level of high-temperature, thermomechanical performance has been realized in Modmor-II-unidirectionally reinforced laminates. For example, a maximum room temperature flexural strengthmodulus level of 281,500 psi17.2 x 10 to the 6th power psi has been realized, with retention of 100 and 84 of initial strength after 50 hr and 100 hr aging, respectively, at 700 F tested at 700 F. This composite lost only 6.5 weight during the 100-hr exposure. A similar laminate retained 61 of its orginial flexural strength after 5 hr at 800 F tested at 800 F, and 39 of same after 1 hr at 1000 F tested at 1000 F. 2912

Subject Categories:

  • Adhesives, Seals and Binders
  • Laminates and Composite Materials

Distribution Statement:

APPROVED FOR PUBLIC RELEASE