Accession Number:

AD0900546

Title:

Advanced Interconnection and Packaging Techniques for Integrated Circuits

Descriptive Note:

Final rept. 1 Jul 1969-31 Jul 1970,

Corporate Author:

RAYTHEON CO ANDOVER MA

Personal Author(s):

• Ilgenfritz, Robert W.
• Keohane, John S.
• Walter, Dieter W.

Report Date:

1972-06-01

Pagination or Media Count:

100.0

Abstract:

The purpose of Phase I of this program was to design, develop, fabricate, and test advanced interconnection and packaging techniques for complex hybrid microassemblies. The vehicle for accomplishing this objective was a package which accommodates a 1 x 1 in. working area, permits hermetic sealing without damaging the microcircuits mounted within this working area, and structurally withstands operating temperatures ranging to 350C. The contractor initiated the program by selecting an approach which takes advantage of the strength and impervious nature of fired multilayer ceramic the adhesion and high temperature durability of refractory metals fired in a reducing atmosphere the hermeticity of welded metal-alloy covers and the inherent reliability which results from the use of buried vias feed-through conductors. Finally, in Phase 2 of this program, the separable ceramic substrate package and lid were redesigned and the parallel-seam welding process was modified to optimize the sealing yeild and corrosion resistance of the 1 x 1 in. working area hybrid circuit package. A 98.5 percent sealing yield was obtained for this redesigned parallel-seam welded package.

Descriptors:

• *INTEGRATED CIRCUITS
• *CIRCUIT INTERCONNECTIONS
• *PACKAGING
• MANUFACTURING
• SUBSTRATES
• REFRACTORY METALS
• SANDWICH CONSTRUCTION
• ELECTRON BEAM WELDING
• REFRACTORY METAL ALLOYS
• HERMETIC SEALS
• BRAZING
• BONDING
• CERAMIC MATERIALS
• LASERS
• LAMINATES

Subject Categories:

• Electrical and Electronic Equipment
• Ceramics, Refractories and Glass
• Laminates and Composite Materials
• Fabrication Metallurgy

Distribution Statement:

APPROVED FOR PUBLIC RELEASE