High-Speed Optical Data Links.
Final rept. 17 Jan 71-17 Jan 72,
IBM FEDERAL SYSTEMS DIV OWEGO NY ELECTRONICS SYSTEMS CENTER
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The contractual goal of this task was to conduct a research and development program to investigate the application of high speed light communications to interconnect large scale integrated LSI circuit functional modules. The effort was performed in three stages. The first stage was a state-of-the-art investigation of devices. Digital light sources and detectors were evaluated and the advantages and disadvantages of each shown. The second stage was a packaging study. Various packaging techniques to allow communication between the LSI wafers were examined. The third stage was to fabricate an operable data link using GaAs transmitter LED and Silicon Avalanche detector and demonstrate various results of the previous stage studies. The resulting data link operated at 55 mhy, 50 duty cycle, digital data rate. Author
- Electrooptical and Optoelectronic Devices
- Non-Radio Communications