Exploratory Development of Structural Adhesives Having Improved Toughness Properties.
Final technical rept. 1 Apr-1 Oct 71,
DEXTER CORP PITTSBURG CA HYSOL DIV
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The objective of this study was to develop an epoxy adhesive system having temperature strength capabilities equal to or better than states of the art adhesives but having increased toughness through optimization of these properties in the ADX-516 AF-A-3516 SYSTEM. These properties should be attainable in both metal to metal bonds and in honeycomb sandwich construction over a temperature range of -67 to 420 F. A process for practical production of the adhesive is developed. P.S.-PL
- Adhesives, Seals and Binders
- Laminates and Composite Materials