Production Engineering Measure. Solid Encapsulated Semiconductor Devices.
Quarterly progress rept. no. 4, 1 Oct 70-1 Jan 71,
MOTOROLA INC PHOENIX AZ SEMICONDUCTOR GROUP
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The objective of this report is to develop the production capacity and processing methods necessary to produce a plastic encapsulated small signal transistor capable of qualifying for military applications. Two aspects of transistor manufacture such as, passivation techniques used during chip fabrication, and the assembly scheme used to encapsulate such chips are discussed. The Si3N4 passivation with the steam getter type of wafer clean was used in the tests. The Dow Corning XRJ-90-709 was used as the die coat. P.S.-PL
- Electrical and Electronic Equipment