Thermal Power Dissipation of Solid State Electric Power Controllers.
NAVAL AIR DEVELOPMENT CENTER WARMINSTER PA AERO-ELECTRONIC TECHNOLOGY DEPT
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A brief study was performed in thermal parameters associated with solid-state load controllers. It was found impractical, with the present state of the art, to realize miniaturization in enclosures for power transistors. Exposed areas, component interface, and bulk thermal resistance are the present limiters in configuration for conventional heat dissipation methods. It is recommended that the power controller specification, MIL-P-81653, be revised to include the thermal design requirements of MIL-T-23103. It is further recommended that special emphasis be placed on developing new materials and techniques to obtain more effective removal of thermal energy for applications of this type. Author
- Electrical and Electronic Equipment