Reliability Characterization and Prediction of Integrated Circuits.
Final technical rept. 20 Sep 68-20 Apr 70,
BOEING AEROSPACE CO SEATTLE WA
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The objective was the development of analytical techniques for reliability characterization and prediction of integrated circuits for use by USAF project engineers and contractors in reliability design and evaluation of USAF microelectronic equipments. The report includes the results of evaluation of USAF microelectronic equipments. The report includes the results of laboratory tests on 11 different integrated circuits under extremely high stresses of temperature, voltage, current, centrifuge, and temperature shock which disclose different mechanisms of degradation applicable to such devices. These test results are integrated with information gained by survey of the causes of integrated circuit failures and a failure mode and mechanism summary is included. The influences of design, processing, testing, and operative influences are discussed. The relative contributions of the different failure causes are assessed. A six-element reliability characterization and prediction model is developed which includes factors for quality, temperature, mechanical environment, chip complexity, interconnect complexity, and package complexity. Author
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems