Accession Number:

AD0876090

Title:

UHF Film Integrated Circuits.

Descriptive Note:

Final rept. 1 Jun 68-31 May 70,

Corporate Author:

RCA LABS PRINCETON NJ

Personal Author(s):

• Caulton, Martin
• DeBrecht, Robert E.
• Hershenov, Bernard
• Hughes, John J.
• Napoli, Louis S.

Report Date:

1970-09-01

Pagination or Media Count:

124.0

Abstract:

Microwave integrated circuits MICs have been under wide investigation and are presently being applied in all segments of the microwave and semiconductor industry. One goal of this investigation was to determine the role of lumped-element circuits as opposed to distributed circuits in the development of MIC technology. Of particular interest were 1 the frequency limitations and 2 power limitations. An additional goal was to investigate the use of MICs at the millimeter-wave frequencies. Studies of novel transmission lines and monolithic GaAs technology for high-frequency MICs were therefore initiated. This report reviews materials and technology for MICs and lumped elements, and describes measurement techniques developed for evaluation of elements, circuits, and materials. Many circuits, both passive and active, were constructed and evaluated. Both lumped and distributed circuits were tested on alumina, sapphire, and GaAs, making use of the technology developed. Author

Descriptors:

• (*INTEGRATED CIRCUITS
• ULTRAHIGH FREQUENCY)
• (*WAVEGUIDES
• STRIP TRANSMISSION LINES)
• (*SEMICONDUCTOR DIODES
• GALLIUM ARSENIDES)
• (*FIXED CAPACITORS
• DIELECTRIC FILMS)
• (*MICROWAVE AMPLIFIERS
• GAIN)
• (*RESISTORS
• SUBSTRATES)
• RESONANT FREQUENCY
• METAL FILMS
• LOW PASS FILTERS
• INDUCTANCE
• MICROELECTRONICS
• SAPPHIRE
• SILICON DIOXIDE
• X BAND
• S BAND

Subject Categories:

• Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE