Development of a 250 Ampere Transcalent Rectifier.
Technical rept. no. 2 (Final) 28 May 69-15 May 70,
RCA ELECTRONIC COMPONENTS LANCASTER PA
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The design of a 250 ampere transcalent rectifier is described in this report. The heat dissipation from the silicon wafer, in which a p-n rectifying junction has been diffused, was improved by joining a heat pipe to each side of the wafer. Design of the devices is discussed with emphasis on the selection of the working fluid for the heat pipe, wick structure, operational characteristics of the heat pipe and fabrication of the devices. The transcalent rectifier was electrically tested and dissipated the power losses while rectifying 250 amperes of current. The tests were conducted during the following operating conditions, while rectifying alternation current at 60 Hz at conduction angles of 180, 120 and 60 degrees, while rectifying current at frequencies varying from 200 to 2600 Hz while rectifying a one cycle surge current of 6500 amperes. In comparing the operation of the transcalent rectifier to a conventional rectifier mounted on a heat sink, the transcalent rectifier was capable of dissipating its power losses in 117 the space and at a junction temperature 70C less than a stud mounted rectifier. The weight of the transcalent rectifier is 17 the weight of a stud rectifier mounted on an aluminum heat sink. Author
- Electrical and Electronic Equipment