Accession Number:

AD0871917

Title:

Guidelines for Transfer Molding Electronic Modules.

Descriptive Note:

Final rept.,

Corporate Author:

WESTINGHOUSE DEFENSE AND ELECTRONIC SYSTEMS CENTER BALTIMORE MD AEROSPACE DIV

Report Date:

1970-03-01

Pagination or Media Count:

90.0

Abstract:

Transfer molding techniques were investigated to develop a Guidelines Document applicable to the production of complex electronic modules. This investigation consisted of both a thorough review of the literature and an extensive test program. The overall investigation important areas of stresses in the important areas of stresses in transfer molded modules, design criteria for transfer molded modules, effects of the transfer molding process on components, material and process parameters of transfer molding, and studies on mold design, equipment and layout. The recommendations and guidelines resulting from the program are given in the Guidelines Document, and the detailed data and information from the program are given in separate Data Volume. Epoxy, FRP-epoxy, mineral filled-epoxy, diallyl phtpalate and silicone were the materials which comprised the electonic modulus. Author, modified-PL

Subject Categories:

  • Electrical and Electronic Equipment
  • Plastics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE