Accession Number:

AD0871826

Title:

Transfer Molding Electronic Modules. Data Volume.

Descriptive Note:

Final rept.,

Corporate Author:

WESTINGHOUSE DEFENSE AND ELECTRONIC SYSTEMS CENTER BALTIMORE MD AEROSPACE DIV

Personal Author(s):

• Harper, Charles A.
• Wyble, Charles W.
• Larson, Charles D.
• DiGiacomo, George M.
• Carter, H. Gray

Report Date:

1970-03-01

Pagination or Media Count:

395.0

Abstract:

Transfer molding techniques were investigated to develop a Guidelines Document applicable to the production of complex electronic modules. This investigation consisted of both a thorough review of the literature and an extensive test program. The overall investigation program included studies in the important areas of stresses in transfer molded modules, design criteria for transfer molded modules, effects of the material and process parameters of transfer equipment and layout. The recommendations and guidelines resulting from the program are given in the Guidelines Document, and the detailed data and information from the program are given in this Data Volume. Epoxy, FRP-epoxy, mineral filled-epoxy diallyl phthalate and silicone were the materials which comprised the electronic modules. Author, modified WERE THE MATERIALS WHICH COMPRISED THE ELECTRONIC MODULES. Author, modified-PL

Descriptors:

• *MOLDINGS
• *MODULES(ELECTRONICS)
• *PLASTICS
• PHTHALATES
• RHEOLOGY
• CURING AGENTS
• PRESSES(MACHINERY)

Subject Categories:

• Electrical and Electronic Equipment
• Plastics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE