Manufacturing Methods for a Multifunction Integrated Circuit Package.
Final rept. May 68-Jun 70,
AUTONETICS ANAHEIM CA
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The purpose of the program was to develop a radiation resistant, hermetically sealed, integral lead package, capable of packaging and interconnecting a number of state-of-the-art uncased integrated circuits. A ceramic laminated multilayer package bases having two buried layers, a system of connecting vias, a solder seal ring and 55 leads was designed. More than 100 substrate package bases were processed in an engineering pilot line and time and yield data taken through each step. Evaluation tests on completed circuits were performed per MIL-STD-750, and a number of radiation tests were made on operational and mechanical circuits. The evaluation tests showed that packaging uncased ICs by ultrasonic face bonding to pedestals processed on the surface of a laminated ceramic package base and protected by a solder sealed cover is feasible and reliable. Author
- Electrical and Electronic Equipment
- Ceramics, Refractories and Glass