Accession Number:

AD0871408

Title:

Improving Strip-Line Packages by the Use of Bonding Techniques,

Descriptive Note:

Corporate Author:

NAVAL WEAPONS CENTER CHINA LAKE CA

Personal Author(s):

• May, Charles B.

Report Date:

1970-06-01

Pagination or Media Count:

53.0

Abstract:

The potential advantages and disadvantages of bonding strip transmission lineboards together are outlined. An approach for bonding Teflon-fiberglass board material is described and evaluated. Bonding of multilayer and multideck stripline sandwiches is discussed. Principal areas which need to be examined in the future are outlined. Author-PL

Descriptors:

• *BONDING)
• (*STRIP TRANSMISSION LINES
• CIRCUITS
• SANDWICH CONSTRUCTION
• SUBSTRATES
• REINFORCED PLASTICS
• HALOCARBON PLASTICS
• GLASS TEXTILES
• PACKAGING

Subject Categories:

• Electrical and Electronic Equipment
• Refractory Fibers
• Laminates and Composite Materials
• Plastics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE