Manufacturing Methods Applicable to Memory System for Microcircuits.
Final rept. 1 Jul 67-1 Aug 69,
SPERRY RAND CORP BLUE BELL PA UNIVAC DIV
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Efforts to establish manufacturing methods for producing a compact, low power, modular memory system are described. The memory uses vacuum deposited MATED FILM storage elements, vacuum evaporated wiring and insulation, integrated circuits ultrasonically face-down bonded to evaporated wiring, and reflow soldered andor welded copper-Mylar interconnections. The design, fabrication, and test of the memory system is reported. The equipment and methods used for MATED FILM deposition, vacuum evaporation, integrated circuit test, face-down bonding, and copper-Mylar reflow soldering andor welding are described. Author
- Computer Hardware
- Manufacturing and Industrial Engineering and Control of Production Systems