Thermal Parameters and Analytical-Experimental Procedures for Integrated Circuit Devices and Systems.
NAVAL AIR DEVELOPMENT CENTER WARMINSTER PA AERO-ELECTRONIC TECHNOLOGY DEPT
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Results of studies of thermal considerations in integral circuit IC devices and systems is presented. Covered are IC thermal parameters, thermal instrumentation and temperature measuring techniques, computer implemented thermal analyses, magnitudes of thermal gradients and thermal resistances, design considerations for a high dissipation-low thermal resistance IC package, IC package to sink thermal analyses, and an IC thermal alarm system. The information presented should be of use to both the user and the manufacturer of integrated circuits. Author
- Electrical and Electronic Equipment