Accession Number:
AD0854823
Title:
NAFI Development of a Hermetically Sealed Size 1-A Module for the Standard Hardware Program.
Descriptive Note:
Interim rept.,
Corporate Author:
NAVAL AVIONICS FACILITY INDIANAPOLIS IND
Personal Author(s):
Report Date:
1969-02-01
Pagination or Media Count:
41.0
Abstract:
This report describes the preliminary investigation, initial design development, and fabrication of hermetically sealed size 1-A module assemblies and the related problem areas of sealing and interconnection bonding techniques. Author
Descriptors:
- *MODULES(ELECTRONICS)
- HERMETIC SEALS
- PINS
- RESISTANCE WELDING
- ULTRASONIC WELDING
- BRASS
- EMBEDDING SUBSTANCES
- ELECTRICAL CONDUCTIVITY
- ELECTRICAL INSULATION
- ELECTRON BEAM WELDING
- SOLDERING
- CONTAMINATION
- PACKAGING
- SEMICONDUCTORS
- ACCEPTABILITY
- GOLD
- ELECTRIC WIRE
- FILMS
- BONDING
- CONFIGURATIONS
- SUBSTRATES
- STRESSES
- METAL COATINGS
- PLATING
- MICROELECTRONICS
- LASERS
Subject Categories:
- Electrical and Electronic Equipment