Accession Number:

AD0854257

Title:

UHF Film Integrated Circuits.

Descriptive Note:

Quarterly rept. no. 3, 1 Dec 68-28 Feb 69,

Corporate Author:

RCA LABS PRINCETON NJ

Report Date:

1969-06-01

Pagination or Media Count:

28.0

Abstract:

The purpose of this project is to investigate lumped-element vs. microstrip circuitry for use 1 at microwave frequencies up to X-band, 2 with high-power active devices, and 3 as transforming networks between radically different impedances. 1 Materials and Technology - Thin-film SiO2 has been densified at moderate temperatures using a water-vapor atmosphere which improves the quality of the dielectric significantly. However, the integrated metal-dielectric-metal sandwich has been degraded by the processing, and the resultant circuit loss is only moderately lower. 2 Measurement Technique - The resonance technique has been used to measure the reactance of lumped elements through X-band. 3 Lumped-Element Hybrids - The integrated versions of directional couplers and filters have been designed and some circuits have been fabricated. 4 Distributed Circuits - A study of chrome resistors in microstrip lines has been made. Further results have been obtained on the frequency-dependent behavior of microstrip lines. Author

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE