Accession Number:

AD0848448

Title:

Integrated Circuit Engineering,

Descriptive Note:

Corporate Author:

FOREIGN TECHNOLOGY DIV WRIGHT-PATTERSON AFB OH

Personal Author(s):

Report Date:

1968-06-20

Pagination or Media Count:

16.0

Abstract:

The author surveys circuit microminiaturization of electronic equipment. As the most recent method he cites the use of solid-state circuits, i.e., thick film, thin film, MOS, and hybrid circuitry and lists progressive miniaturization from electronic tube to biological system. Semiconductor block engineering and transistorization, especially in relation to silicon and germanium, are discussed and insulated solid state circuits are emphasized including diffusion methods, epitaxially grown layers and the use of elements consisting of very thin oxide layers, or of wide intermediate air spaces beam-lead engineering. Author

Subject Categories:

  • Electrical and Electronic Equipment
  • Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE