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Failure Analysis of Minuteman Integrated Circuit Failures.

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Final rept. 20 Feb 67-17 Feb 68,

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This program was devoted to the determination of the failure modes and to a study of the failure mechanisms in integrated circuits used in the Minuteman II control and guidance system. In-depth failure analyses were performed on 114 rejects from system equipment and 75 failures from vendor burn-in tests. Analytical and procedural techniques not ordinarily used in routine failure analysis were applied and evaluated on this program. The in-depth analysis identified the major device failure modes as 1 excessive surface leakage current, 2 cracked die, 3 oxide dielectric defects pinholes, and 4 die-to-header bond failures. Localization of certain failure modes to particular part types and vendors along with device usage in system must be considered in assessing the relative importance of the failure modes. The results were compared with data from routine analysis and from the Component Quality Assurance Program. A thorough radiographic examination was performed on a group of 292 devices which had retested good upon submission to in-house analysis. The examination showed that 5 percent of the sample had movable metallic particles included in the package, and a total of 29 percent had some potential reliability hazard. A similar examination of 4,999 production parts revealed an incidence of 0.4 percent with included movable particles. It is felt that the results of this program demonstrate the value of conducting a more extensive routine failure analysis. Author

Subject Categories:

  • Electrical and Electronic Equipment
  • Manufacturing and Industrial Engineering and Control of Production Systems
  • Surface-Launched Guided Missiles

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