Accession Number:

AD0844883

Title:

UHF Film Integrated Circuits.

Descriptive Note:

Quarterly rept. no. 1, 1 Jun-31 Aug 68,

Corporate Author:

RCA LABS PRINCETON NJ

Report Date:

1968-11-01

Pagination or Media Count:

55.0

Abstract:

The purpose of this project is to investigate lumped-element vs. microstrip circuitry for use at microwave frequencies up to X-band, with highpower active devices, and as transforming networks between radically different impedances. Requirements for high-quality integrated lumped elements and microstrip transmission lines are discussed. Besides the standard Cu and Au evaporation of conductors, at least one skin depth of W and Mo has been successfully sputtered and vapor-deposited on sapphire. Characteristics of several glasses have been studied, and techniques to obtain densified glasses with low dielectric losses have been improved. Various integrated systems involving metal-dielectric-metal sandwiches have been tried, and a gold-glass-copper-gold sandwich has been found to be a satisfactory compromise. The loss measurements of networks, utilizing the scattering-coefficient method Deschamps, are described. A resonance measurement to study lumped elements at S- to X-band frequencies is analyzed lumped-element inductors remain truly lumped up to at least 6 GHz. Performance of uncoupled microstrip lines in the form of filters, branch-line couplers, and phase shifters is described. Directional couplers have been designed and fabricated, and measurements on coupled lines have been made to determine the even- and odd-mode characteristics. Preliminary results on the operation of a microstrip quadrupler 1.77 to 7.08 GHz, at 1.6 watts with 28 efficiency are reported. Author

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE