Ultrasonic Face Bond Reliability Study
Final technical rept. Nov 1966-Jun 1968
AUTONETICS ANAHEIM CA
Pagination or Media Count:
The report discusses a program concerned with the effect of ultrasonic bonding energy on the oxide coating of integrated circuit chips to experimentally determine the optimum face-bonded assembly design and to fabricate and test a number of the practical best assemblies.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems