Accession Number:

AD0844307

Title:

Metallization Failures in Integrated Circuits

Descriptive Note:

Final rept. 28 Dec 1966-27 Apr 1968

Corporate Author:

MOTOROLA INC PHOENIX AZ SEMICONDUCTOR GROUP

Personal Author(s):

Report Date:

1968-10-01

Pagination or Media Count:

101.0

Abstract:

Six potential failure modes involving aluminum as the metallization material for semiconductor devices have been investigated in an attempt to obtain a better understanding of the processes involved and to obtain equations which relate device failure to known physical parameters. This information should enable the construction of reliable devices with predictable lifetimes.

Subject Categories:

  • Electrical and Electronic Equipment
  • Metallurgy and Metallography

Distribution Statement:

APPROVED FOR PUBLIC RELEASE