Metallization Failures in Integrated Circuits
Final rept. 28 Dec 1966-27 Apr 1968
MOTOROLA INC PHOENIX AZ SEMICONDUCTOR GROUP
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Six potential failure modes involving aluminum as the metallization material for semiconductor devices have been investigated in an attempt to obtain a better understanding of the processes involved and to obtain equations which relate device failure to known physical parameters. This information should enable the construction of reliable devices with predictable lifetimes.
- Electrical and Electronic Equipment
- Metallurgy and Metallography