Reliability Studies for Advanced Integrated Circuits Engineering Change 'A'.
Final technical rept. 14 Feb 67-31 Mar 68,
PHILCO-FORD CORP BLUE BELL PA MICROELECTRONICS DIV
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The goal of this phase II of the program was to measure the effectiveness of a sequence of nondestructive screening tests in detecting and weeding out unreliability silicon monolithic analog microcircuits from production lots to eliminate the failure modes that had been determined during Phase I to exist in such dielectric SIO2 isolated devices. The contract specified a sequence of nine tests visual and environmental to be performed. The stress conditions were to be dictated by the results of the first phase. The required tests were visual examinations, high temperature cycling, centrifuge and package leak testing. Of the 220 devices thus tested, the surviving microcircuits were then placed on 2000-hour operating life test at 125C ambient. The results of the tests on this group were then compared with those on a control group of 100 devices which had been subjected to no screening tests except visual inspections, leak testing, and electrical testing, but which were placed on the same operating life test. Author
- Electrical and Electronic Equipment