Accession Number:

AD0840576

Title:

MEMORY SYSTEM FOR MICROCIRCUITS.

Descriptive Note:

Final rept. 1 May 66-15 Dec 67,

Corporate Author:

SPERRY RAND CORP PHILADELPHIA PA UNIVAC DIV

Personal Author(s):

• Weilerstein, Marvin I.

Report Date:

1968-08-01

Pagination or Media Count:

187.0

Abstract:

A program to design and develop manufacturing processes for a compact, low power, modular memory is described. The memory uses electroplated magnetic film storage elements, vacuum evaporated wiring and insulation, integrated circuits ultrasonically face-down bonded to evaporated wiring, and welded copper-Mylar tape interconnections. Design, fabrication, and test of the memory is reported. Manufacturing processes and equipment are described for magnetic film plating, vacuum evaporation, face-down bonding, and copper-Mylar tape welding. Development of a set of integrated selection and recirculation circuits is reported. Author

Descriptors:

• *THIN FILM STORAGE DEVICES)
• (*DATA STORAGE SYSTEMS
• INTEGRATED CIRCUITS
• VAPOR PLATING
• VACUUM APPARATUS
• BONDING
• ULTRASONIC WELDING
• POLYESTER PLASTICS
• COPPER
• FILMS
• ELECTRODEPOSITION
• ETCHING
• MANUFACTURING

Subject Categories:

• Fabrication Metallurgy
• Plastics
• Computer Hardware

Distribution Statement:

APPROVED FOR PUBLIC RELEASE