MEMORY SYSTEM FOR MICROCIRCUITS.
Final rept. 1 May 66-15 Dec 67,
SPERRY RAND CORP PHILADELPHIA PA UNIVAC DIV
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A program to design and develop manufacturing processes for a compact, low power, modular memory is described. The memory uses electroplated magnetic film storage elements, vacuum evaporated wiring and insulation, integrated circuits ultrasonically face-down bonded to evaporated wiring, and welded copper-Mylar tape interconnections. Design, fabrication, and test of the memory is reported. Manufacturing processes and equipment are described for magnetic film plating, vacuum evaporation, face-down bonding, and copper-Mylar tape welding. Development of a set of integrated selection and recirculation circuits is reported. Author
- Fabrication Metallurgy
- Computer Hardware