Accession Number:

AD0840289

Title:

INVESTIGATION OF HEAT REMOVAL FROM BOTH SIDES OF A TRANSISTOR CHIP EMBODYING BUMP TECHNOLOGY.

Descriptive Note:

Final rept. May 67-Jun 68,

Corporate Author:

HUGHES AIRCRAFT CO NEWPORT BEACH CA MICROELECTRONICS LAB

Personal Author(s):

Report Date:

1968-09-01

Pagination or Media Count:

53.0

Abstract:

The purpose of the work was to determine the feasibility of removing heat simultaneously from both the collector and emitter sides of a double diffused transistor chip. The work consisted of forming a large silver bump over the emitter and a small bump for base contact on the front side of a power transistor chip. This chip was mounted face down on a modified TO-60 header and a large silver strap was used to contact the collector on the back side. A non-multiple emitter structure mounted as above showed a 40 decrease in thermal resistance over a chip mounted face up in a standard manner. Author

Subject Categories:

  • Electrical and Electronic Equipment
  • Thermodynamics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE