INVESTIGATION OF HEAT REMOVAL FROM BOTH SIDES OF A TRANSISTOR CHIP EMBODYING BUMP TECHNOLOGY.
Final rept. May 67-Jun 68,
HUGHES AIRCRAFT CO NEWPORT BEACH CA MICROELECTRONICS LAB
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The purpose of the work was to determine the feasibility of removing heat simultaneously from both the collector and emitter sides of a double diffused transistor chip. The work consisted of forming a large silver bump over the emitter and a small bump for base contact on the front side of a power transistor chip. This chip was mounted face down on a modified TO-60 header and a large silver strap was used to contact the collector on the back side. A non-multiple emitter structure mounted as above showed a 40 decrease in thermal resistance over a chip mounted face up in a standard manner. Author
- Electrical and Electronic Equipment