INFRARED FOR ELECTRONICS EQUIPMENT DIAGNOSIS.
Final technical rept. 15 May 67-15 May 68,
RAYTHEON CO WAYLAND MA WAYLAND LABS
Pagination or Media Count:
A study was conducted employing infrared techniques for fault isolation on complex electronic printed circuit panels. A study consisted of evaluating panels containing both random defects and circuit anomalies. It was verified that approximately 70 of the defects and anomalies were identified by infrared analysis. Fundamental work was carried on in two other areas. The first was making radiant energy available from components buried in a thick opaque encapsulating material and the second involved evaluating component temperatures using thermo-sensitive phosphors. It was verified that both approaches are feasible. Proposed specifications for infrared testing of electronic circuit assemblies were developed. These specifications stressed the system approach to infrared test equipment outlining the following test areas acceptance testing, engineering design evaluation, stress analysis of component parts, reliability calculations, production testing and troubleshooting, and preventive maintenance. Author
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems