FABRICATION OF ULTRATHIN SOLID ELECTROLYTE BATTERIES.
Quarterly progress rept. no. 3, 1 Oct 67-1 Jan 68,
TECHNICAL OPERATIONS INC BURLINGTON MA
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Experiments were performed that have led to a better comprehension of the causes for increased dc internal resistance of vacuum-deposited thin-film silver halide cells. Creation of voids in the silver electrode-electrolyte interface was demonstrated to be partly responsible for the gradual increase in internal impedance. These voids may be due to the presence of neutral halogen in the electrolyte, creation of unevenness at the interface during the transfer of mass from electrode to electrolyte, mechanical breaking of contact during thermal expansion and contraction of the electrode film and electrolyte, or slow phase transformation of the electrolyte upon cooling. It was found that the silver iodide evaporation had no detectable effects on the platinum films, indicating that a platinum halide barrier is not the principal source of the increase in internal resistance. On the other hand, a deterioration of the gold film in AuAgBrAg cells was observed during the silver bromide evaporation that was caused by the evolution of bromine but this could be prevented by slightly altering the evaporation conditions. Silver bromide, did not seem to attack gold films while in contact. An ac conductivity bridge was built for ionic conductivity measurements. The conductivity of evaporated silver bromide was calculated. Author
- Electrochemical Energy Storage