Accession Number:

AD0829336

Title:

THERMAL ASPECTS OF INTEGRATED CIRCUITRY.

Descriptive Note:

Final rept.,

Corporate Author:

MOTOROLA INC SCOTTSDALE AZ GOVERNMENT ELECTRONICS DIV

Personal Author(s):

Report Date:

1967-12-15

Pagination or Media Count:

119.0

Abstract:

Contents Design Considerations for a High Dissipation-Low Thermal Resistance Integrated Circuit Package Integrated Circuit Device to Sink Thermal Analysis and Miniaturized Electronic Thermal Alarm.

Subject Categories:

  • Electrical and Electronic Equipment
  • Thermodynamics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE