Accession Number:

AD0829336

Title:

THERMAL ASPECTS OF INTEGRATED CIRCUITRY.

Descriptive Note:

Final rept.,

Corporate Author:

MOTOROLA INC SCOTTSDALE AZ GOVERNMENT ELECTRONICS DIV

Personal Author(s):

• Welling, J. R.

Report Date:

1967-12-15

Pagination or Media Count:

119.0

Abstract:

Contents Design Considerations for a High Dissipation-Low Thermal Resistance Integrated Circuit Package Integrated Circuit Device to Sink Thermal Analysis and Miniaturized Electronic Thermal Alarm.

Descriptors:

• *INTEGRATED CIRCUITS
• THERMAL PROPERTIES
• ELECTRONIC EQUIPMENT
• MOLYBDENUM
• RARE GASES
• BONDING
• BERYLLIUM
• COPPER
• ELECTRICAL RESISTANCE
• PRINTED CIRCUITS
• MATHEMATICAL MODELS
• WARNING SYSTEMS
• MINIATURE ELECTRONIC EQUIPMENT
• HEAT FLUX
• THERMAL CONDUCTIVITY
• THERMAL ANALYSIS
• THERMAL INSULATION
• CONFIGURATIONS
• MICROWAVE EQUIPMENT
• HEAT TRANSFER
• SILICON
• GOLD
• PLATING
• ALUMINUM
• TEST METHODS

Subject Categories:

• Electrical and Electronic Equipment
• Thermodynamics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE