INVESTIGATION OF MICROELECTRONIC THERMAL SENSORS FOR CIRCUIT EFFECTS MEASUREMENTS.
Final rept. Mar 66-Mar 67,
BOEING AEROSPACE CO SEATTLE WA
Pagination or Media Count:
The objective of the program was to investigate the feasibility of new techniques for measuring the circuit effects of low level RF currents. The primary circuit elements investigated were Electroexplosive Devices EEDs. Measurements of the electrical and thermal parameters of thermocouple instrumented and un-instrumented EEDs are described, and the results are discussed. Data from impedance measurements on a PC-37 power cartridge for frequencies of 1 megahertz MHz to 22 gigahertz GHz are given. Thermal profile measurements of a PC-37 bridgewire are described and discussed for d-c and microwave frequency bridgewire currents. Thermal sensor design considerations for circuit component and EED evaluations are discussed. Data from the application of the thermocouple to actual circuit component evaluation are given. Techniques for mounting and making electrical contact to whisker thermistors are described. Measurements of the electrical and thermal properties of SiC whiskers and thin films of Al2O3 whiskers are described and discussed. Evaluations as to the use of a whisker as a low-mass microelectronics thermal sensor are made. Time response and sensitivity measurements are described and results discussed. From the evaluations it has been concluded that whisker thermal sensors offer both improved sensitivity and time response characteristic over that afforded with current state-of-the-art sensors. Author
- Electrical and Electronic Equipment
- Test Facilities, Equipment and Methods
- Radiofrequency Wave Propagation