EVALUATION OF FLIP/CHIP INTEGRATED CIRCUIT INTERCONNECTIONS.
Final development rept. 15 Oct 65-15 Oct 66.
HONEYWELL INC FRAMINGHAM MA COMPUTER CONTROL DIV
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In the final quarter of this study, work concentrated on thermal and ultrasonic methods of solder bonding and on methods and problems associated with packaging a FlipChip module. Finally, an evaluation was made of all the information gathered and a best approach selected. Author
- Electrical and Electronic Equipment
- Fabrication Metallurgy