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Accession Number:
AD0806935
Title:
EVALUATION OF FLIP/CHIP INTEGRATED CIRCUIT INTERCONNECTIONS.
Descriptive Note:
Final development rept. 15 Oct 65-15 Oct 66.
Corporate Author:
HONEYWELL INC FRAMINGHAM MA COMPUTER CONTROL DIV
Report Date:
1967-01-25
Pagination or Media Count:
88.0
Abstract:
In the final quarter of this study, work concentrated on thermal and ultrasonic methods of solder bonding and on methods and problems associated with packaging a FlipChip module. Finally, an evaluation was made of all the information gathered and a best approach selected. Author
Distribution Statement:
APPROVED FOR PUBLIC RELEASE