Accession Number:

AD0806935

Title:

EVALUATION OF FLIP/CHIP INTEGRATED CIRCUIT INTERCONNECTIONS.

Descriptive Note:

Final development rept. 15 Oct 65-15 Oct 66.

Corporate Author:

HONEYWELL INC FRAMINGHAM MA COMPUTER CONTROL DIV

Personal Author(s):

Report Date:

1967-01-25

Pagination or Media Count:

88.0

Abstract:

In the final quarter of this study, work concentrated on thermal and ultrasonic methods of solder bonding and on methods and problems associated with packaging a FlipChip module. Finally, an evaluation was made of all the information gathered and a best approach selected. Author

Descriptors:

• THERMAL JOINING
• ULTRASONIC WELDING
• SUBSTRATES
• SOLDERING
• CIRCUIT INTERCONNECTIONS
• ALUMINATES
• ALUMINUM
• SEALS(STOPPERS)
• THERMAL STABILITY

Subject Categories:

• Electrical and Electronic Equipment
• Fabrication Metallurgy

Distribution Statement:

APPROVED FOR PUBLIC RELEASE