Analysis of Semiconductor Structures by Nuclear and Electrical Techniques: Silicide Formation.
Final rept. 1 Apr 73-30 Apr 74,
CALIFORNIA INST OF TECH PASADENA DEPT OF ELECTRICAL ENGINEERING
Pagination or Media Count:
The reactions between metal layers and Si or SiO2 substrates are major considerations in choice of metallization systems for integrated circuits. Since these reactions can occur at temperatures as low as 100C, it is necessary to make the proper choice of metal layers to obtain satisfactory metalSi contacts compatible with processing technology. In the past year May 73 to May 74 the work at Caltech has concentrated on evaluation of silicide formation. Primary emphasis was placed on Pd, Ni and V. For some metals Nb, V, Ti the metal layers were deposited on SiO2 as well as Si. In this work metal layers 1000 to 4000A thick are deposited and silicide growth kinetics determined by MeV He backscattering spectrometry and phase identification by glancing angle x-ray diffraction. Modified author abstract
- Atmospheric Physics
- Physical Chemistry
- Solid State Physics