Macromodular Computer Design. Part 2. Manufacturing Description. Volume III. Electronic Package Assembly.
Final rept. 1 Apr 65-31 Dec 73,
WASHINGTON UNIV ST LOUIS MO COMPUTER SYSTEMS LAB
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Manufacturing documents, including parts lists, assembly pictorials, and adjustment procedures for the DECODE, LOAD, CALL, MERGE and DATA BRANCH macrocmodule electronic subassemblies are given. Author
- Computer Hardware