Accession Number:

AD0783432

Title:

Hardened Hybrid Semiconductor Packages.

Descriptive Note:

Final rept. 28 Jun-31 Dec 73,

Corporate Author:

WESTINGHOUSE DEFENSE AND ELECTRONIC SYSTEMS CENTER BALTIMORE MD SYSTEMS DEVELOPMENT DIV

Personal Author(s):

Report Date:

1974-05-01

Pagination or Media Count:

81.0

Abstract:

The work was performed to develop a radiation hardened packaging technique for connecting integrated circuit chips. The interconnecting metal was chosen to be vapor deposited aluminum. The two layer substrate upon which the chips were mounted had beam leads integral with the metallization on the substrate. The two aluminum layers and the aluminum oxide dielectric layer were deposited in sequence through masks in a single vacuum chamber pumpdown. Author

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE