Damage Profiles in Silicon and Their Impact on Device Reliability
Technical rept. no. 3, 6 Jun 1972-30 Dec 1973
IBM CORP HOPEWELL JUNCTION NY EAST FISHKILL LABS
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It is the purpose of this report to substantiate the previously reported findings on saw damage in silicon wafer surfaces and their dependency on the slicing technique. The measurements reported here concentrate on measurements of damage depth in as-sliced silicon wafers, on saw damage measurements in wafers , on saw damage measurements in wafers sliced horizontally H-wafers compared to wafers sliced vertically V-Wafers, and, finally, on the measurement of fracture strength of silicon crystals and on the seed to tail variation of fracture strength in such crystals.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems
- Solid State Physics