Investigation of Novel Heat Removal Techniques for Power Transistors.
Final rept. 15 Nov 71-15 Sep 73,
HUGHES AIRCRAFT CO FULLERTON CALIF GROUND SYSTEMS GROUP
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ECTRICAL CHARACTERISTICS OF THE DEVICES ARE TO BE WITHIN 10 of conventional devices, the volume no more than 4 times, and the weight no more than 5 times that of equivalent hermetically sealed devices. Achievement of these objectives was based on the application of heat pipe cooling techniques to the chip surface, within a standard TO-package. The conclusions to be drawn from the program are that the cooling method provides significant improvement in the thermal characteristics of the VHF power transistors without loss of RF performance. No significant deterioration of performance was noted in the extended duration high temperature testing. These goals were achieved without significant change in the transistor case size or weight. The cooling techniques demonstrated on this program are recommended for production development. Author
- Electrical and Electronic Equipment