Accession Number:

AD0768142

Title:

Chip and Wire Assembly and Packaging Facilities for Prototype Microelectronic Integrated Circuits,

Descriptive Note:

Corporate Author:

ARMY MATERIEL COMMAND TEXARKANA TEX INTERN TRAINING CENTER

Personal Author(s):

Report Date:

1971-07-01

Pagination or Media Count:

96.0

Abstract:

The goal of the report is to provide a realistic and comprehensive cost estimate for two microelectronic chip and wire assembly and final packaging facilities for prototype microelectronic hybrid integrated circuits. An analysis is made of typical costs that should be anticipated for the initial installation, operation, and staffing of chip and wire assembly and packaging facilities. Modified author abstract

Subject Categories:

  • Electrical and Electronic Equipment
  • Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE