Development of Microcircuit Bond-Pull Screening Techniques.
Final rept. 21 Dec 71-1 Dec 72,
GENERAL ELECTRIC CO UTICA N Y AEROSPACE ELECTRONIC SYSTEMS DEPT
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The development of microcircuit bond-pull screening techniques was undertaken to determine if prestressing of interconnecting wire bonds within a microcircuit package would be a feasible technique for removing weak bonds prior to sealing. The primary concern was determining if prestressing was destructive to the long life of the bonds. Test samples included both gold and aluminum 1 mil wire bonds, fabricated in two different package configurations, providing variations in wire length and loop height. The wire bonds were prestressed at a pull strength level equivalent to 40 of the average breaking strength of the wire. Both prestressed and unprestressed bonds were subjected to a testing program of package processing, MIL-STD-883 Class B screening and accelerated life testing. The results showed that prestressing, even at the relatively high levels used, had no long term degrading effect on the reliability of wire bonds and was a very useful screen for detecting poorly made bonds. The technique may be used as a 100 screen or as a product sampling test for bonding control. Cost factors may limit its usefulness. Modified author abstract
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems