Microelectronic Interconnection Bonding with Ribbon Wire
Final rept. 1 Jun 1971-31 May 1972
NATIONAL BUREAU OF STANDARDS WASHINGTON DC ELECTRONIC TECHNOLOGY DIV
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The feasiblity of using aluminum ribbon wire for ultrasonic bonding of semiconductor microelectronic interconnections was studied, and several advantages over the use of round wire of equivalent cross-sectional area were found. Ribbon wire bonds exhibited little deformation or heel damage, and a greater percentage of bonds of a certain quality as judged by pull strength and appearance could be made over much greater ranges of the bonding machine parameters, time and tool tip displacement, using ribbon wire than was possible with round wire. The ease of positioning ribbon wire was indicated by making multiple ribbon wire bonds side-by-side on a 5-mil square pad, or by stacking up to four bonds one on top of another. However, bonding with harder than normal wire, previously though to offer certain advantages with respect to higher bond tensile strength, yielded inconsistent results.
- Electrical and Electronic Equipment