Migration of Silver Through Gold Plating on Electrical Contacts
ARMY MISSILE RESEARCH DEVELOPMENT AND ENGINEERING LAB REDSTONE ARSENAL AL GROUND EQUIPMENT/MATERIALS DIRECTORATE
Pagination or Media Count:
An investigation was conducted to determine the extent and composition of migrated silver that had pervaded the gold plate of electrical connector contact pins. An extensive electron microscopic analysis of the form and shapes of the masses of crystalline silver and silver salt accumulations on the gold surfaces is presented. Comparisons are made between the corroded pins and newly produced nickel flash underplated pins.
- Physical Chemistry
- Electrical and Electronic Equipment