Investigation of Novel Heat Removal Techniques for Power Transistors.
Interim technical rept. 15 Nov 71-15 Aug 72,
HUGHES AIRCRAFT CO FULLERTON CALIF GROUND SYSTEMS GROUP
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The feasibility of new cooling methods for VHF power transistors capable of providing a reduction in junction temperature of 33, compared to conventionally packaged devices has been investigated. Design objective for the transistors are a minimum power dissipation of 25 watts CW power from a 28-volt supply with a minimum power gain of 6 dB. The electrical characteristics of the devices are to be within 10 of conventional devices, the volume no more than 4 times, and the weight no more than 5 times that of equivalent hermetically sealed devices. Achievement of these objectives was based on the application of heat pipe cooling techniques to the chip surface, within a standard TO-package. Author
- Electrical and Electronic Equipment
- Air Conditioning, Heating, Lighting and Ventilating