Accession Number:

AD0750948

Title:

Solder for Connecting Semiconductor Systems with a Metal Base

Descriptive Note:

Corporate Author:

FOREIGN TECHNOLOGY DIV WRIGHT-PATTERSON AFB OH

Personal Author(s):

Report Date:

1972-08-01

Pagination or Media Count:

8.0

Abstract:

The report concerns solder for connecting semiconductor systems with a metal base having a different thermal expansibility. It is distinguished by the fact that it is composed of 45-90 lead, 1-10 gold and the rest indium.

Subject Categories:

  • Metallurgy and Metallography

Distribution Statement:

APPROVED FOR PUBLIC RELEASE