Accession Number:

AD0745731

Title:

Polyimide Films for Hybrid Circuits.

Descriptive Note:

Technical memo.,

Corporate Author:

JOHNS HOPKINS UNIV SILVER SPRING MD APPLIED PHYSICS LAB

Personal Author(s):

Report Date:

1972-05-01

Pagination or Media Count:

47.0

Abstract:

Polyimide films have a unique combination of properties that makes them ideally suited for hybrid and beam lead substrates. They maintain desirable chemical, electrical, and physical properties over a wide temperature range. Results of studies at APL show that these properties are advantageous in the fabrication of prototype hybrids, such as experimental amplifiers, inductors, and microwave circuits. Author

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE