Multi-Chip Integrated Circuit Package.
Final technical rept. 1 Jun 68-31 Aug 71,
GTE LABS INC WALTHAM MASS
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The objective of the contract is to reduce to practice a compatible multi-chip interconnection system for unpackaged integrated circuits, eliminating insofar as possible wire bonds and interconnection interfaces, and achieving high yield, low cost, and high reliability. A pilot production line was set up in this project to product sufficient units for test and cost evaluation. This project is based on the use of beam-leaded ICs and an air-insulated beam-lead crossover interconnection method. This is the final report on this multi-chip contract. The conclusions and recommendation sections support the basic advantages of the beam-lead system. Author
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems