Accession Number:

AD0736790

Title:

Multi-Chip Integrated Circuit Package.

Descriptive Note:

Final technical rept. 1 Jun 68-31 Aug 71,

Corporate Author:

GTE LABS INC WALTHAM MASS

Report Date:

1971-08-01

Pagination or Media Count:

270.0

Abstract:

The objective of the contract is to reduce to practice a compatible multi-chip interconnection system for unpackaged integrated circuits, eliminating insofar as possible wire bonds and interconnection interfaces, and achieving high yield, low cost, and high reliability. A pilot production line was set up in this project to product sufficient units for test and cost evaluation. This project is based on the use of beam-leaded ICs and an air-insulated beam-lead crossover interconnection method. This is the final report on this multi-chip contract. The conclusions and recommendation sections support the basic advantages of the beam-lead system. Author

Subject Categories:

  • Electrical and Electronic Equipment
  • Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE